Non-destructive inspection of thermoelectric modules by scanning acoustic microscopy
DOI:
https://doi.org/10.63527/1607-8829-2024-4-26-33Keywords:
thermoelectric modules, non-destructive inspection, scanning acoustic microscopyAbstract
In this work we present the potential of Scanning Acoustic Microscopy (SAM) as an important nondestructive evaluation (NDE) method for process control as well as failure analysis of thermoelectric modules (TE-M). SAM is one part of the so called ‘Dream Team Concept’ which is described in detail in section 1.
References
1. H. Chae, et al., Feasibility study on energy harvesting with thermoelectric generators in a photovoltaic-ground source heat pump system, Energy Reports 11 (2024).
2. M. Chen, Note: Extraction of temperature-dependent interfacial resistance of thermoelectric modules, American Institute of Physics (2011).
3. V. Semenyuk, et al., Diffusion Protection of Thermoelectric Cooler Junctions as a Means of Increasing its Reliability, Proc. of 5th European Conference on Thermoelectrics , September 10 - 12, 2007, Odessa (2007).
4. W. Liu, et al., Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 legs for power generation applications, J. Mater. Chem. A (2013).
5. W. Liu, et al., Thermoelectric interface materials: A perspective to the challenge of thermoelectric power generation module, Journal of Materiomics 5 (3) (2019).
6. H. Yu, Scanning acoustic microscopy for material evaluation, Appl. Microsc. 50, 25 (2020).
7. L. Su et al., Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer, Sensors 13 (2013).
8. Sonolab, Introduction to Acoustic Micro Imaging, training materials (no date).
9. L. V. Mesquita, Failure Analysis of PV Modules using Scanning Acoustic Microscopy, Albert-Ludwigs-Universität Freiburg, Master Thesis (2019).
