Study of Fe-W-Cr and Ni-Cr-W Systems for the Development of High-Quality Anti-Diffusion Coatings
DOI:
https://doi.org/10.63527/1607-8829-2025-4-76-81Keywords:
semiconductor, thermoelectric materials, nanostructure, solid solutions, tellurides, n- p- types, resistance, contact, chemical bond, binary compounds, theoretical models, quantum patterns, electron density, state diagramsAbstract
A theoretical study of Fe-W-Cr and Ni-Cr-W metal systems as bases for anti-diffusion coatings in thermoelements is presented. Using the calculation of dissociation energies, the stability of the components and their ability to form effective barrier layers are assessed. The constructed graphs of the dependence of the dissociation energy on the interatomic distances make it possible to predict the optimal ratios of components to increase diffusion stability.
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