Computer simulation of the extrusion process of Ві-Те based thermoelectric material of rectangular shape
Keywords:
thermoelectric material, hot extrusion, computer simulation, dieAbstract
During hot extrusion, the thermoelectric material heated to a temperature below its melting point passes through the mold (die) under the action of pressure. In the present paper, this process has been simulated with the use of Comsol Multiphysics application package of object-oriented simulation. In this model, the extruded material is presented as a liquid with a very high viscosity, which depends on the velocity and temperature. As a result of simulation, the distributions of temperature and material flow velocity in the die were obtained as well аs stress distribution in the die due to external pressure and thermal loads during the tape extrusion process. These studies make it possible to optimize the installation for the production of extruded thermoelectric material. Bibl. 4, Fig. 6, Tabl. 2.
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